Methods for forming semiconductor device packages

ABSTRACT

A semiconductor device package that incorporates a combination of ceramic, organic, and metallic materials that are coupled using silver is provided. The silver is applied in the form of fine particles under pressure and a low temperature. After application, the silver forms a solid that has a typical melting point of silver, and therefore the finished package can withstand temperatures significantly higher than the manufacturing temperature. Further, since the silver is an interfacial material between the various combined materials, the effect of differing material properties between ceramic, organic, and metallic components, such as coefficient of thermal expansion, is reduced due to low temperature of bonding and the ductility of the silver.

RELATED APPLICATION

This application is a divisional of co-pending, U.S. patent applicationSer. No. 14/068,496, filed on Oct. 31, 2013.

BACKGROUND

This disclosure relates generally to semiconductor device packaging, andmore specifically, to a low-temperature process for fabricating hightemperature and high performance semiconductor device packages.

A variety of semiconductor device packages include a combination ofceramic, organic, and metallic materials. In order to form a usablestructure for the semiconductor device package, these differingmaterials are in contact with one another. These differing materialsoften have significantly different material properties that can causefailures of a semiconductor device package incorporating the materials.It is therefore desirable to have semiconductor device packages thatincorporate materials having differing material properties but that arenot subject to failures due to the differing material properties (e.g.,coefficient of thermal expansion).

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention may be better understood, and its numerousobjects, features, and advantages made apparent to those skilled in theart by referencing the accompanying drawings.

FIG. 1 is a simplified block diagram illustrating a cross-sectional viewof an air cavity package.

FIG. 2 is a simplified block diagram illustrating a plan view of the aircavity package.

FIG. 3 is a simplified block diagram of a cross sectional view of asystem at a stage in processing in which device die are coupled to metalcoins or slugs embedded in a PCB or other package substrate.

FIG. 4 is a simplified block diagram of a cross sectional view of asystem at a stage in processing in which device die are coupled tosintered silver vias in a PCB or other package substrate.

FIG. 5 is a simplified block diagram of a cross sectional view of asystem at a stage in processing in which a copper slug is incorporatedin a sintered silver large via.

FIG. 6 is a simplified block diagram of a cross sectional view of asystem at a stage in processing in which a pair of metal slugs areincorporated in a sintered silver large via.

FIG. 7 is a simplified block diagram of a cross sectional view of asystem at a stage in processing in which a passive component isincorporated in a sintered silver large via.

The use of the same reference symbols in different drawings indicatesidentical items unless otherwise noted. The figures are not necessarilydrawn to scale.

DETAILED DESCRIPTION

Embodiments of the present invention provide for a semiconductor devicepackage that incorporates a combination of ceramic, organic, andmetallic materials that are coupled using silver. The silver is appliedin the form of fine particles (e.g., nano particle silver) underpressure and a low temperature (e.g., sintering at 250° C.). Afterapplication, the silver forms a solid that has a typical melting pointof silver (i.e., approximately 962° C.), and therefore the finishedpackage can withstand temperatures significantly higher than themanufacturing temperature. Further, since the silver is an interfacialmaterial between the various combined materials, the effect of differingmaterial properties between ceramic, organic, and metallic components,such as coefficient of thermal expansion, is reduced due to lowtemperature of bonding and the ductility of the silver. In otherembodiments, the silver can be used in place of or in conjunction withcopper slugs in printed circuit boards for attachment of heat sinks orlarge through vias. Such embodiments provide a thinner PCB than istypical for included copper slugs.

Different types of high performance semiconductor device packagesincorporate a combination of ceramic, organic, and metallic materials.But differing property characteristics of these materials can causefailures in the resultant package. For example, widely differingcoefficients of thermal expansion between ceramic and copper can causehigh stress in the package that can cause warping and cracking of thepackage near the connection between these materials.

One example of such packages is an air cavity package that typicallyincludes one or more semiconductor device die attached to a base plateand an insulative window frame surrounding the die. A cap is placed overthe window frame, sealing the die in a cavity of air. Air cavitypackages can be used to house high frequency devices such asradio-frequency (RF) die. Packaging a high frequency semiconductordevice in encapsulated air can improve high frequency properties of thedie and electrical leads, as compared to encapsulation in a moldingcompound that has a higher dielectric constant than air.

FIG. 1 is a simplified block diagram illustrating a cross-sectional viewof an air cavity package 100. FIG. 2 is a simplified block diagramillustrating a plan view of air cavity package 100. An air cavitypackage uses a conductive metal base plate 110 that can incorporate adie attach region 120. A window frame 130 made of a ceramic material isattached to the conductive metal base plate. Window frame 130 isgenerally attached to the conductive metal base plate prior to a dieattach process. Conductive leads 140 are disposed on a top surface ofthe window frame and are used to make electrical contact 142 and 144 toa die 150 included in the package. Conductive leads 140 can be insertedinto a recess along the top of window frame 130. A cap 160 is attachedto the top of the leads and the window frame, which seals a cavity 170.

Conventional processes for forming an air cavity package, such as thatillustrated in FIG. 1, involve attaching window frame 130 to conductivemetal base plate 110 using a high temperature brazing process (e.g.,850° C.). Such high processing temperatures preclude use of copper baseplates with ceramic window frames because a coefficient of thermalexpansion (CTE) mismatch between copper and ceramic materials inducescracks in the ceramic window frame at brazing temperatures. Thus,conductive metal base plate 110 is typically made of a CuMOCu orCu(CuMo)Cu laminate or CuW when a ceramic window frame is used. But bothCuMOCu and Cu(CuMo)Cu laminates, as well as CuW, have significantlylower thermal conductivity than pure copper, which reduces the overallthermal performance of the package.

While epoxies can be used to attach a ceramic window frame to a metalbase plate prior to die attach, epoxies can be damaged during subsequenthigh temperature die attach processes and thereby have a lowerreliability. While some conventional air cavity techniques can involveattaching the window frame after die attach, those window frames aretypically constructed of plastic which has a much lower thermalconductivity and capacitance than a ceramic window frame. This can limitthe use of air cavity packages with plastic window frames to lower powerapplications.

Embodiments of the present invention provide for using silver 190, 192as an interface material between ceramic window frame 130 and bothconductive metal base plate 110 and conductive leads 140 (e.g., atinterface regions 175 and 180). The silver 190, 192 is applied using alow-temperature sintering technique in which a fine particle silverpaste, powder, or film is applied to the region of interest under heatand pressure. The silver particles are of nano-scale, and thereforesurface energies of the molecules forming the particles can dominateinteractions between the particles, including surface tension, therebyallowing for formation of solid silver at a temperature significantlylower than the melting point of silver. Once the solid silver region isformed, a typical melting point of the silver applies (i.e.,approximately 960° C.).

In the air cavity package illustrated in FIGS. 1 and 2, a silversintering process can be performed by applying fine particle silver 190to conductive metal base plate 110 at interface region 175. Ceramicwindow frame 130 is then applied to the fine particle silver at atemperature and pressure sufficient to cause the silver particles tobond to one another and to the materials of the ceramic window frame andthe conductive metal base plate. In order to enhance the bonding betweenthe silver and the ceramic window frame, the ceramic window frame can bemetalized using a number of metalizing techniques known in the art(metallization layer 135). For example, the ceramic window frame can bemetalized using a direct plated copper process, a directed bonded copperprocess, a refractory metal fire plus nickel/gold plating, or a thinfilm process using TiNiAu, TiW, gold, and the like.

In one embodiment, the temperature used during the sintering process isbetween approximately 200-300° C., and typically around 250° C., wellbelow brazing temperatures used for prior art air cavity packages.Similarly, fine particle silver 192 can be applied at interface region180 on ceramic window frame 130 and conductive leads 140 can be appliedunder a temperature and pressure to cause the silver particles to bond.The sintered silver 190, 192 at the interfaces provides a dual effect,an adhesive coupling of the differing materials together and anelectrical/thermal coupling.

Fine particle silver can be applied using a variety of techniques. Apaste containing the fine particle silver can be used. Such a paste canbe sprayed on, printed on, or otherwise applied. A powder form of thefine particle silver can also be used, and applied using similarmethods. Alternatively, a pre-formed film incorporating fine particlesilver and organic materials can be used by placing the film betweenparts desired to be bonded under a low temperature (e.g., 250° C.) andadded pressure. The organic material of the film is removed under suchprocess conditions and the solid silver is formed.

Since the bonding process is performed at significantly lowertemperatures than that of prior art brazing techniques, effects due tothe differing CTE of ceramic and metal are avoided (e.g., ceramiccracking and warping). Further, less expensive and more efficientmaterials can be used for conductive metal base plate 110. For example,a solid copper flange can be used instead of a laminate flange as theconductive metal base plate. In addition, conductive leads 140 can beformed of a solid copper rather than an alloy. In both cases, use ofsolid copper, rather than a laminate or an alloy, improves electricalconductivity and, in the case of the conductive metal base plate,thermal conductivity. Solid copper also provides significant costbenefits over laminates and alloys. A die attach region for the flangecan include, for example, AuSi, AuSn, or sintered silver. In addition,according to the needs of the application, the package system can beplated to cover the sintered silver, using, for example, NiAu or NiPdAuat various stages of the package buildup (e.g., before die attach andafter hermetic lidding).

Another semiconductor device package structure that can derive benefitsfrom use of sintered silver is for high power devices employing metalcoins in a package substrate or PCB. Traditionally, power components areprovided to a system using individually packaged components that arecoupled to the system PCB. A heat sink is coupled to the power componentpackage. Therefore, there can be multiple connections between a powerdevice die in the component package and the heat sink. This can resultin an inefficient transfer of heat from the power device die to the heatsink. In addition, the power component package, along with all thevarious connections, can take up significant space in the systempackage. Further, since there are limited provided geometries of thepackaged components, the use of those packaged components limits theflexibility of system geometries.

FIG. 3 is a simplified block diagram of a cross sectional view of asystem 300 at a stage in processing in which power device die arecoupled to metal coins or slugs embedded in a PCB or other packagesubstrate (alternatively, the power device die or passive device diecould be coupled to the metal coins or slugs to enhance grounding).System 300 includes a package substrate 310, such as a PCB. Packagesubstrate 310 has embedded metal coins 320 and 330. The metal coins havea high thermal or electrical conductivity, depending upon theapplication. For many thermal applications, a copper coin is usedbecause of copper's high electrical and thermal properties. Further,copper can be readily incorporated into circuit board designs. In theexamples below, the metal coins are specifically discussed to be copper,but other metals (e.g., aluminum) and composites (e.g., AlSiC, Agdiamond, and Cu graphite) with high thermal or electrical conductivitycan be used, as the application warrants.

As will be discussed more fully below, embedded copper coins 320 and 330can be embedded using methods known in the art, as appropriate to theapplication. Power device die 340 and 350 are coupled to embedded coppercoins 320 and 330 respectively. As will be discussed more fully below,the methods for coupling the power device die to the embedded coppercoins depend upon the application. Power device die 340 and 350 arecoupled to the embedded copper coins at coupling regions 342 and 352,respectively. The coupling regions can be thermal or electrical or both,depending upon the application. On the major surface of the power devicedie opposite the major surface including the coupling regions, powerdevice die 340 includes terminal pads 344 and 346, while power devicedie 350 includes signal pads 354 and 356. A device die 360 is shown asadhesively coupled to package substrate 310. Device die 360 can be anycomponent not needing the advantages of being coupled to an embeddedcopper coin, such as a low power device die or a passive component.Device die 360 includes terminal pads, such as terminal pad 362, on themajor surface opposite that coupled to the package substrate.

The power device die can be coupled to the embedded copper coins in avariety of ways, depending upon whether the copper coin is embedded in apreassembled PCB or is initially separate from a PCB and the PCB thenassembled around the copper coin after attachment to the power devicedie. In those instances where the copper coin is embedded in apreassembled PCB, methods for attaching the power device die to thecopper coin should take into account temperature limitations associatedwith processing of a premade PCB. That is, if too a high temperature isused in coupling the power device die to the embedded copper coin, thendamage may occur to other areas of the premade PCB. Such a coupling canbe performed using a low-temperature silver die attach. Low-temperaturesilver die attach methods known in the art can form an acceptable bondbetween the silicon die and the copper coin using temperatures ofapproximately 250° C. Such low-temperature die attach techniques includethe use of nanoscale silver pastes or sintered silver, as discussedabove, and typically provide better electrical, thermal andthermomechanical properties than traditional solder techniques. Asstated above, another advantage of using low-temperature die attachtechniques to couple the power device die to the embedded copper coinsis avoiding damage to the remaining portions of the PCB.

Wire bonds 370, 375, 380, and 385 are used to couple the contact pads onthe active surface of power device die 340 and 350 and device die 360with one another and with contact pads provided on substrate 310 (notshown). An interconnect and other circuitry provided on the substrate(not shown) can provide additional connections between the variousdevice die. Subsequent to formation of the communication net provided bythe wire bonds, a molding material is applied over and around the powerdevice dies, the device die, wire bonds, and over the substrate, formingan encapsulant 390 that encapsulates the structures within the moldingmaterial and forms a panel.

The molding material can be any appropriate encapsulant including, forexample, silica-filled epoxy molding compounds, plastic encapsulationresins, and other polymeric materials such as silicones, polyimides,phenolics, and polyurethanes. The molding material can be applied by avariety of standard processing techniques used in encapsulationincluding, for example, printing, pressure molding, and spinapplication. Once the molding material is applied, the panel can becured by exposing the materials to certain temperatures for a period oftime, or by applying curing agents, or both. In a typical encapsulationprocess, a depth of encapsulant 390 can exceed a maximum height ofstructures embedded in the molding material.

In an alternative embodiment, the wire bonded structures of FIG. 3 canbe packaged as an air cavity system. In such a case, encapsulant wouldnot be used to cover the various components of the system. Instead, apre-molded cavity package can be used to surround the various componentsand a cap or a lid can replace the encapsulant to protect the componentswithin the cavity package. In some instances, a silicone gel can be usedto further protect the components by being applied over and around thecomponents and the wire bonds. In a further alternative embodiment, thewires can be replaced with a redistributed chip scale package system toprovide the package interconnects.

As discussed above, embedded copper coins 320 and 330 are typicallyembedded in substrate 310 using a variety of techniques known in theart. One technique involves building up the substrate (e.g., PCB) aroundthe copper coins. The coins are at least mechanically attached to thebuilt up substrate, and can also be electrically coupled to thesubstrate as the substrate is built up, according to the needs of theapplication. Another technique involves press fitting the coins in apre-built up substrate. In such a situation, the embedded copper coinsare mechanically attached to the substrate. A disadvantage of both ofthese prior art methods for incorporating embedded copper coins is thenecessary thickness of the substrate. In typical applications, thesubstrate would be between 32 (e.g., built up) and 40 (e.g., press fit)mils.

FIG. 4 is a simplified block diagram of a cross sectional view of asystem 400 at a stage in processing in which power device die arecoupled to sintered silver vias in a PCB or other package substrate.FIG. 4 is an alternative to the structure of FIG. 3 in that the embeddedcopper coins of FIG. 3 are replaced by large vias 430 and 440. Largevias 420 and 430 are formed from sintered silver and bonded to theorganic material of substrate 410. The sintered silver material can bedirectly bonded to the organic material of substrate 410 or, as shown,through an intermediate bonded plating metal 425 and 435 along edges ofa drilled hole through the substrate for vias 420 and 430, respectively.As discussed above, sintered silver vias 420 and 430 can be formed usinga fine particle silver paste applied within the via holes under a lowtemperature and added pressure, or using a pre-formed film under lowtemperature and added pressure. The silver bonds to the bonded platingmetal which, in turn, is bonded to the multi-layer printed circuitboard. Bonded plating metal 425 and 435 be a variety of plating metals,as appropriate to the application, and can typically be silver, copper,palladium, or gold.

As illustrated in FIG. 4, one advantage of using large vias formed ofsintered silver is a significantly reduced thickness of the printedcircuit board over PCBs incorporating embedded copper coins. Powerdevice die 340 and 350 are thermally and/or electrically coupled to thelarge vias using techniques known in the art for coupling to silver(alternatively, passive semiconductor devices can be coupled to thelarge vias). The other components illustrated for system 400 correspondto similarly numbered elements of system 300 in FIG. 3.

Large via formation using sintered silver also provides opportunitiesfor incorporation of other materials and devices within the large viaregion. This is due to the low temperature formation of the silver, andthe electrical and thermal coupling properties of the formed silver.

FIG. 5 is a simplified block diagram of a cross sectional view of asystem at a stage in processing in which a copper slug is incorporatedin a sintered silver large via. Substrate 510 includes a large via 515.Large via 515 can be plated along the edges using a plating metal suchas gold, silver, or copper using techniques known in the art. Large via515 further includes sintered silver 530 and a copper slug 540. Copperslug 540 can be placed into position before or after the application ofa fine particle silver used for formation of sintered silver 530 (e.g.,a nano-silver paste). The sintering process can then be applied in thelarge via region to form the large via having both sintered silver andthe copper slug. Such a large via can incorporate both the advantages ofthe sintered silver (e.g., thinness, electrical, and cost) and thethermal advantages of copper. Alternative metallic slugs can be used inplace of a copper slug, according to the needs of the application.Further, alternatively diamond or ceramics, such as low-temperaturecofired ceramics (LTCC) having dielectric and conductive elements, canbe included in the large via in place of copper slug 540.

FIG. 6 is a simplified block diagram of a cross sectional view of asystem at a stage in processing in which a pair of metal slugs areincorporated in a sintered silver large via. Substrate 610 includes alarge via 615. The large via can be formed by, for example, a drillingprocess or during build up of the substrate. The area of the through viaalong the major surfaces can be larger than that within the PCB. Thesides of the large via are metalized using a plating metal such as gold,silver, or copper (e.g., 620). Sintered silver 630 and metal slugs 640and 645 are incorporated in the via hole, wherein the silver is bondedto the metalizing 620. As with the embodiment in FIG. 5, the silver isintroduced to large via 615 in the form of fine particle silver (e.g., anano-silver paste) under a low temperature (e.g., 250° C.) and, incertain applications, an added pressure in order to form the sinteredsilver. Metal slugs 640 and 645 can be copper slugs or another metal,according to the application. Plating metal 620 can provide both aphysical connection to the organic portion of the PCB along with anelectrical connection to metalized interconnects within a laminate ofthe PCB or built up along the surfaces.

FIG. 7 is a simplified block diagram of a cross sectional view of asystem at a stage in processing in which a passive component isincorporated in a sintered silver large via. Substrate 710 includes alarge via 715. The large via can be formed by, for example, a drillingprocess or during build up of the substrate. The area of the through viaalong the major surfaces can be larger than that within the PCB. Thesides of the top and bottom regions of the large via can be metalizedusing a plating metal such as gold, silver, or copper (e.g., 720).Sintered silver 730 is within the large via along with a low cost chipcomponent 740. Low cost chip component 740 can be, for example, a highcapacitance (HiC) component in an electrical pathway defined by sinteredsilver 730 and plating metal 720. As with the embodiment in FIG. 6,plating metal 720 can provide both a physical connection to the organicportion of the PCB along with an electrical connection to metalizedinterconnects within a laminate of the PCB or built up along thesurfaces.

By now it should be appreciated that there has been provided asemiconductor device package that includes a first material portion thatincludes one of a ceramic or an organic material, a second materialportion that includes a metallic material, and a sintered silver regiondisposed the adhesively couple the first and second material portions ofthe semiconductor device package. In one aspect of the above embodiment,the semiconductor device package is an air cavity package, the firstmaterial portion includes a metalized ceramic window frame, and thesecond material portion includes a conductive metal base plate. In afurther aspect, the second material portion includes a solid coppermetal base plate.

In another aspect of the above embodiment, the semiconductor devicepackage is an air cavity package, the first material portion includes ametalized ceramic window frame, and the second material portion includesa conductive metal lead. A further aspect includes an air cavity cap.The air cavity cap is adhesively coupled to a surface of the metalizedceramic window frame and a surface of the conductive metal lead using alayer of sintered silver.

In another aspect of the above embodiment, the sintered silver region isformed by applying fine particles silver at a formation temperaturelower than the melting point of silver. In a further aspect, theformation temperature is between approximately 200° C. and 300° C.

In another aspect of the above embodiment, the first material portionincludes a printed circuit board, and the sintered silver region isdisposed within a hole formed in the printed circuit board. In a furtheraspect, the second material portion is a metallic slug disposed withinthe sintered silver region. A still further aspect includes asemiconductor device die thermally coupled to the metallic slug wherethe metallic slug includes copper. Another further aspect includes asecond metallic slug disposed within the sintered silver, where thesintered silver thermally and electrically couples the metallic slug andthe second metallic slug. In another further aspect, the second materialportion includes a passive electronic device disposed within thesintered silver region, where the sintered silver electrically couplesthe passive electronic device to an interconnect formed on the printedcircuit board. In a still further aspect, the passive semiconductordevice includes a high capacitance material.

Another embodiment of the present invention provides a method forforming a semiconductor device package. The method includes: forming,from a first material, a first material portion of the semiconductordevice package where the first material includes one of a ceramic or anorganic material; providing a second material portion of thesemiconductor device package where the second material includes one of aceramic or a metallic material; and, adhesively coupling the first andsecond material portions of the semiconductor device package using asintered silver region.

In one aspect of the above embodiment, the semiconductor device packageis an air cavity system, said forming the first material portion furtherincludes forming a ceramic window frame, and the second material portionincludes a conductive metal base plate. In another aspect, thesemiconductor device package is an air cavity system, said forming thefirst material portion further includes forming a ceramic window frame,and the second material portion includes a conductive metal lead.

In another aspect of the above embodiment, adhesively coupling the firstand second material portions further includes forming a sintered silverregion by applying a fine particle silver at a formation temperaturelower than the melting point of silver. In a further aspect, theformation temperature is between approximately 200° C. and 300° C.

In another aspect of the above embodiment, forming the first materialportion further includes forming a printed circuit board and forming ahole in the PCB, and the adhesively coupling includes forming thesintered silver region within the hold in the PCB. A further aspectincludes disposing the second material portion in the sintered silverregion, where the second material portion is a metallic slug.

Because the apparatus implementing the present invention is, for themost part, composed of electronic components and circuits known to thoseskilled in the art, circuit details will not be explained in any greaterextent than that considered necessary as illustrated above, for theunderstanding and appreciation of the underlying concepts of the presentinvention and in order not to obfuscate or distract from the teachingsof the present invention.

Moreover, the terms “front,” “back,” “top,” “bottom,” “over,” “under”and the like in the description and in the claims, if any, are used fordescriptive purposes and not necessarily for describing permanentrelative positions. It is understood that the terms so used areinterchangeable under appropriate circumstances such that theembodiments of the invention described herein are, for example, capableof operation in other orientations than those illustrated or otherwisedescribed herein.

Although the invention is described herein with reference to specificembodiments, various modifications and changes can be made withoutdeparting from the scope of the present invention as set forth in theclaims below. For example, metallic materials other than copper can beused in the various packages. Accordingly, the specification and figuresare to be regarded in an illustrative rather than a restrictive sense,and all such modifications are intended to be included within the scopeof the present invention. Any benefits, advantages, or solutions toproblems that are described herein with regard to specific embodimentsare not intended to be construed as a critical, required, or essentialfeature or element of any or all the claims.

The term “coupled,” as used herein, is not intended to be limited to adirect coupling or a mechanical coupling.

Furthermore, the terms “a” or “an,” as used herein, are defined as oneor more than one. Also, the use of introductory phrases such as “atleast one” and “one or more” in the claims should not be construed toimply that the introduction of another claim element by the indefinitearticles “a” or “an” limits any particular claim containing suchintroduced claim element to inventions containing only one such element,even when the same claim includes the introductory phrases “one or more”or “at least one” and indefinite articles such as “a” or “an.” The sameholds true for the use of definite articles.

Unless stated otherwise, terms such as “first” and “second” are used toarbitrarily distinguish between the elements such terms describe. Thus,these terms are not necessarily intended to indicate temporal or otherprioritization of such elements.

What is claimed is:
 1. A method for forming a semiconductor devicepackage, the method comprising: forming a hole in a package substrate;disposing a silver particle containing material in the hole; placing ametal coin in the hole; and performing a sintering process to convertthe silver particle containing material into sintered silver, whereinthe sintered silver couples the metal coin to the package substrate. 2.The method of claim 1, wherein: the package substrate is a printedcircuit board.
 3. The method of claim 1, wherein disposing the silverparticle containing material in the hole comprises: applying fineparticle silver in the hole.
 4. The method of claim 1, wherein disposingthe silver particle containing material in the hole comprises: applyingnano-silver paste in the hole.
 5. The method of claim 1, whereinperforming the sintering process comprises: subjecting the semiconductordevice package to a formation temperature lower than a melting point ofsilver.
 6. The method of claim 5, wherein: the formation temperature isbetween 200 degrees Celsius and 300 degrees Celsius.
 7. The method ofclaim 1, further comprising: attaching a semiconductor die to the metalcoin with sintered silver.
 8. The method of claim 1, wherein: the metalcoin is a formed from a material selected from copper, aluminum,aluminum, AlSiC, Ag diamond, and copper graphite.
 9. The method of claim1, further comprising: applying a plating metal along edges of the hole.10. A method for forming a semiconductor device package, the methodcomprising: applying a silver particle containing material between a topsurface of a base plate and a bottom surface of an insulative frame;performing a sintering process to convert the silver particle containingmaterial into sintered silver, wherein the sintered silver couples thebottom surface of the insulative frame to the top surface of the baseplate; and attaching a conductive metal lead to a top surface of theinsulative frame.
 11. The method of claim 10, wherein applying thesilver particle containing material comprises: applying fine particlesilver between the top surface of the base plate and the bottom surfaceof the insulative frame.
 12. The method of claim 10, wherein applyingthe silver particle containing material comprises: applying nano-silverpaste between the top surface of the base plate and the bottom surfaceof the insulative frame.
 13. The method of claim 10, wherein performingthe sintering process comprises: subjecting the semiconductor devicepackage to a formation temperature lower than a melting point of silver.14. The method of claim 13, wherein the formation temperature is between200 degrees Celsius and 300 degrees Celsius.
 15. The method of claim 10,wherein: the insulative frame is formed from a ceramic material.
 16. Themethod of claim 10, further comprising: forming a metallization layer onthe bottom surface of the insulative frame.
 17. The method of claim 10,wherein: the base plate comprises solid copper.
 18. The method of claim10, wherein: the base plate comprises at least one material selectedfrom a copper-molybdenum-copper (CuMoCu) laminate, a copper,copper-molybdenum, copper (Cu(CuMo)Cu) laminate, and copper-tungsten(CuW).
 19. The method of claim 10, wherein attaching the conductivemetal lead to the insulative frame comprises: applying the silverparticle containing material between the top surface of the insulativeframe and the conductive metal lead; and performing a sintering processto convert the silver particle containing material into sintered silver,wherein the sintered silver couples the conductive metal lead to the topsurface of the insulative frame.
 20. The method of claim 19, wherein:the conductive metal lead comprises solid copper.